tqp3m9006 high linearity lna gain block applications ? repeaters ? mobile infrastructure ? lte / wcdma / cdma / edge ? general purpose wireless 16-pin 3x3 qfn package product features functional block diagram ? 500-4000 mhz ? 13.5 db gain @ 1.9 ghz ? 1.0 db noise figure @ 1.9 ghz ? +38.5 dbm output ip3 ? +22.4 dbm p1db ? 50 ohm cascadable gain block ? unconditionally stable ? high input power capability ? +5v single supply, 90 ma current ? 3x3 mm qfn package general description pin configuration the tqp3m9006 is a high linearity low noise gain block amplifier in a low-cost surface-mount package. at 1.9 ghz, the amplifier typically provides 13.5 db gain, +38.5 dbm oip3, and 1.2 db noise figure while only drawing 90 ma current. the device is housed in a leadfree/green/rohs-compliant industry-standard 16-pin 3x3mm qfn package. the tqp3m9006 has the benefit of having high linearity while also providing very low noise across a broad range of frequencies. this allows the device to be used in both receive and transmit chai ns for high performance systems. the amplifier is internally matched using a high performance e-phemt process and only requires an external rf choke and bloc king/bypass capacitors for operation from a single +5v supply. the internal active bias circuit also enables stable operation over bias and temperature variations. the tqp3m9006 covers the 0.5- 4 ghz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure. pin # symbol 2 rf input 11 rf output / vdd all other pins n/c or gnd backside paddle gnd ordering information part no. description tqp3m9006 high linearity lna gain block TQP3M9006-PCB 0.5-4 ghz evaluation board standard t/r size = 2500 pieces on a 7? reel. data sheet: rev c 05/26/11 - 1 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ?
tqp3m9006 high linearity lna gain block data sheet: rev c 05/26/11 - 2 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature -55 to 150 o c rf input power,cw,50 ? ,t=25oc + 20 dbm device voltage,vdd +7 v operation of this device outsi de the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max units vdd 3.0 5 5.25 v tcase -40 +85 o c tj (for>10 6 hours mttf ) 190 o c electrical specifi cations are measured at sp ecified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions unle ss otherwise noted: +25oc, +5v vsupply, 50 ? system. parameter conditions min typical max units operational frequency range 500 4000 mhz test frequency 1900 mhz gain 12 13.5 15 db input return loss 13 db output return loss 19 db output p1db +22.4 dbm output ip3 see note 1. +35 +38.5 dbm noise figure 1.0 db supply voltage, vdd +5 v current, idd 68 90 112 ma thermal resistance (jnc to case) jc 54.5 o c/w notes: 1. oip3 is measured with two tones at an output power of 4 dbm / tone separated by 1 mhz. th e suppression on the largest im3 prod uct is used to calculate the oip3 using 2:1 rule. 2:1 rule gives relative value with re spect to fundamental tone.
tqp3m9006 high linearity lna gain block device characterization data 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 gain (db) frequency (ghz) de-embedded gain gain (db) de-embedded s-parameter vcc = 5v 0 1.0 1.0 -1.0 10.0 1 0 . 0 - 1 0 . 0 5.0 5 . 0 - 5 . 0 2.0 2 . 0 - 2 . 0 3.0 3 . 0 - 3 . 0 4.0 4 . 0 - 4 . 0 0.2 0 . 2 - 0 . 2 0.4 0 . 4 - 0 . 4 0.6 0 . 6 - 0 . 6 0.8 0 . 8 - 0 . 8 s11 swp max 6ghz swp min 0.01ghz s(1,1) 0 1.0 1.0 -1.0 10.0 1 0 . 0 - 1 0 . 0 5.0 5 . 0 - 5 . 0 2.0 2 . 0 - 2 . 0 3.0 3 . 0 - 3 . 0 4.0 4 . 0 - 4 . 0 0.2 0 . 2 - 0 . 2 0.4 0 . 4 - 0 . 4 0.6 0 . 6 - 0 . 6 0.8 0 . 8 - 0 . 8 s22 swp max 6ghz swp min 0.01ghz s(2,2) s-parameter data v dd = +5 v, i cq = 90 ma, t = +25 c, unmatched 50 ohm system, calibrated to device leads freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -16.84 -151.32 23.531 168.18 - 28.093 6.4819 -13.835 -175.95 100 -17.401 -164.51 23.315 165.29 -28.064 6.2924 -14.006 164.09 200 -17.287 -168.02 22.903 156. 16 -27.93 10.039 -14.114 138.62 400 -16.259 -169.15 21.851 138.35 -27.459 17.79 -14.288 101.29 800 -14.058 -173.2 19.184 111.93 -25.857 30.27 -15.59 50.117 1000 -13.461 -175.46 17.931 102.1 -24.902 33.496 -16.791 30.427 1200 -13.096 -177.29 16.795 93.532 -23.936 36.097 -18.092 9.8602 1500 -12.757 -177.2 15.241 81.983 - 22.616 37.018 -19.269 -24.674 1900 -12.718 -173.31 13.397 68.817 - 21.104 36.304 -18.018 -60.918 2000 -12.97 -172.34 12.969 65.789 - 20.821 36.102 -17.678 -67.922 2200 -13.043 -169.97 12.161 60.064 -20.183 34.744 -16.05 -77.206 2500 -13.062 -163.57 11.043 52.376 - 19.352 32.905 -14.575 -88.454 2600 -13.221 -163 10.671 49.934 -19. 117 32.135 -14.005 -90.198 3000 -13.475 -157.55 9.3978 40.398 -18.141 28.959 -12.674 -99.96 3500 -14.256 -162.42 8.1567 28.943 - 17.037 24.266 -12.843 -111.14 4000 -14.52 178.56 7.1124 16.613 -16. 013 16.846 -14.488 -134.94 data sheet: rev c 05/26/11 - 3 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ?
tqp3m9006 high linearity lna gain block application circuit configuration notes: bill of material: TQP3M9006-PCB reference desg. value description manufacturer part number u1 high linearity lna gain block triquint tqp3m9006 c2, c6 100 pf cap, chip, 0603, 50v, npo, 5% various c1 0.1 uf cap, chip, 0603, 16v, x7r, 10% various l2 47 nh ind, chip, 0603, 5% various c3 4.7 uf cap, chip, 0603, 6.3v, x5r, 20% various b1 0 ? res, chip, 0603, 1/16w, 5% various l1, d1, c4 do not place various 1. see pc board layout, under applications info rmation section, for more information. 2. components shown on the silkscreen but not on the schematic are not used. 3. b1 (0 ? jumper) may be replaced with copper trace in the target application layout. data sheet: rev c 05/26/11 - 4 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ?
tqp3m9006 high linearity lna gain block typical performance TQP3M9006-PCB test conditions unless otherwise noted: +25oc, +5v, 90 ma, 50 ? system. the data shown below is measured on TQP3M9006-PCB frequency mhz 500 900 1900 2600 gain db 21.2 18.7 13.5 10.7 input return loss db 13 13 13 14 output return loss db 10 14 19 15 output p1db dbm +22.3 +22.3 +22.4 +22.6 oip3 [1] dbm +36.8 +37.3 +38.5 +38.9 noise figure [2] db 1.0 1.1 1.0 1.5 notes: 1. oip3 measured with two tones at an output power of +4 dbm / t one separated by 1 mhz. the suppr ession on the largest im3 product is used to calculate the oip3 using 2:1 rule. 2. noise figure data shown in the table above is measured on evaluation board and corrected for the board loss of around 0.13db @ 1.9 ghz. performance plots performance plots data is measured using TQP3M9006-PCB. noise figure plot has been corrected for evaluation board loss of around 0.13db @ 1.9 ghz. 6 8 10 12 14 16 18 20 22 24 0.00.51.01.52.02.53.03.54.0 gain (db) frequency (ghz) gain vs. frequency -25 -20 -15 -10 -5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 input return loss (db) frequency (ghz) input return loss vs. frequency vcc = 5v data sheet: rev c 05/26/11 - 5 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? +85 c +25 c ? 40 c vcc = 5v +85 c +25 c ? 40 c -25 -20 -15 -10 -5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 output return loss (db) frequency (ghz) output return loss vs. frequency 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.5 1.0 1.5 2.0 2.5 3.0 nf (db) frequency (ghz) noise figure vs. frequency +85 c +25 c ? 40 c vcc = 5v +85 c +25 c ? 40 c vcc = 5 v
tqp3m9006 high linearity lna gain block performance plots 30 35 40 45 50 024681012 oip3 (dbm) output power (dbm) oip3 vs. output power/tone freq. = 900 mhz 1mhz tone spacing 30 35 40 45 50 024681012 oip3 (dbm) output power/tone (dbm) oip3 vs. output power/tone freq. = 1900 mhz 1 mhz tone spacing vcc = 5v vcc = 5v +85 c +85 c +2 5 c ? 30 c ? 40 c +2 5 c ? 30 c ? 40 c ? 30 35 40 45 50 01234567 oip3 (dbm) output power/tone (dbm) oip3 vs. output power/tone 1 mhz tone spacing temp. = 25 o c vcc = 5v 2600 mhz 20 21 22 23 24 -40-20 0 20406080 p1db (dbm) temperature (c) p1db vs. temperature data sheet: rev c 05/26/11 - 6 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? 500 mhz 1900 mhz 900 mhz vcc = 5v
tqp3m9006 high linearity lna gain block pin description ? pin symbol description 2 rf input input, matched to 50 ohms. external dc block is required. 11 vdd / rfout output, matched to 50 ohms, external dc block is required and supply voltage. all other pins gnd these pins are not connected internally but are recommended to be grounded on the pcb for optimal isolation. gnd paddle backside paddle. multiple vias should be employed to minimize inductance and thermal resistance; see page 7 for mounting configuration. applications information pc board layout top rf layer is .014? nelco n4000-13, ? r = 3.9, 4 total layers (0.062? thick) for mechanical rigidity. metal layers are 1-oz copper. 50 ohm microstrip line details: width = .029?, spacing = .035? the pad pattern shown has been developed and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended. for further technical information, refer to www.triquint.com data sheet: rev c 05/26/11 - 7 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ?
tqp3m9006 high linearity lna gain block mechanical information package information and dimensions this package is lead-free/rohs-compliant. the plating material on the leads is annealed matte tin. it is compatible with both lead- free (maximum 260 c reflow temperature) and lead (maximum 245 c reflow temperature) soldering processes. the component will be marked with a ?9006? designator with an alphanumeric lot code on the top surface of package. triquint 9006 yyww axxxx mounting configuration all dimensions are in millimeters (inches). angles are in degrees. notes: 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated thru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. data sheet: rev c 05/26/11 - 8 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ?
tqp3m9006 high linearity lna gain block product compliance information esd information esd rating: class 1a value: passes ? 250 v to < 500 v test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value: passes ? 1000 v test: charged device model (cdm) standard: jedec standard jesd22-c101 msl rating msl 1 at +260 c convection reflow the part is rated mois ture sensitivity level 1 at 260c per jedec standard ipc/jedec j-std-020. solderability compatible with the latest version of j-std-020, lead free solder, 260 this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information abou t triquint: web: www.triquint.com tel: +1.503.615.9000 email: info-sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatso ever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and th e entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any part y any patent rights, licenses, or any other intellectual prope rty rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be exp ected to cause severe pers onal injury or death. data sheet: rev c 05/26/11 - 9 of 9 - disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ?
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